| APACK is a heatpipe
technology based thermal solution provider which provides customized
designing and engineering solutions and, ultimately, provides
best-of breed thermal solutions. APACK¡¯s
design and manufacturing is based
upon an engineer¡¯s passion for innovation and progress.
APACKwas established in 1999 by
3 engineers from ETRI (Electrics and Telecommunications Research
Institute) who have 10~17 years experience in thermal solutions
and advance packaging technology (packaging referring to the
structural and functional integration of multiple technologies).
Based in the city of Daejeon (Korean Silicon Valley and high-tech
capital), APACK is staffed with top engineers who have extensive
experience.
APACK is currently
entering into its second phase of business development after
accomplishing its first goals of developing a strong R&D
core in thermal technology and efficient manufacturing capabilities.
Phase one was marked by strong revenues and growth in the
OEM and custom solutions market producing for such clients
and Samsung, Dell and LG.
>Backed by investors
such as Intel Capital, a strong backbone of R&D with continued
cooperation with ETRI and APACK is seeking to become a global
player in the thermal solutions market.
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